| 型号/型号规格 | 分类 | 品牌 | 封装 | 批号 | 数量 | 询价 | ||
|---|---|---|---|---|---|---|---|---|
| ADXL357BEZ-RL7 | IC |
ADI/亚德诺 |
CLCC14 |
24+ |
1500 |
|||
| ADXL355BEZ-RL7 | IC |
ADI/亚德诺 |
CLCC14 |
24+ |
1500 |
|||
| TLE7259-3GE | INFINEON/英飞凌 |
SOP8 |
24+ |
30000 |
||||
| GH100-885K-A1 | IC |
NVIDIA/英伟达 |
BGA |
24+ |
200 |
|||
| KLM8G1GETF-B041 | IC |
SAMSUNG/三星 |
FBGA |
25+ |
34000 |
|||
| K4A4G165WF-BCTD | IC |
SAMSUNG/三星 |
FBGA |
25+ |
13000 |
|||
| MMA4Z00-NS | 模块 |
NVIDIA/英伟达 |
23+ |
148 |
||||
| HBM3E 36G | 存储器 |
SAMSUNG/三星 |
24+ |
1000 |
||||
| OPA211AIDR | IC |
TI/德州仪器 |
24+ |
5000 |
||||
| HBM3E 24G | 存储器 |
SAMSUNG/三星 |
24+ |
800 |
||||
| 88E3018-A2-NNC1I000 | Marvell/美满科技 |
QFN64 |
23+ |
350 |
||||
| EFR32MG24A410F1536IM40-BR | IC |
SILICON/芯科 |
QFN40 |
23+ |
20000 |
|||
| R7F7015834AFP-C#KA3 | RENESAS/瑞萨 |
LQFP144 |
23+ |
3200 |
||||
| ICL7662EBA+T | MAXIM/美信 |
SOP8 |
25+ |
5000 |
||||
| HI-8282APQT-10 | HOLT |
QFP |
23+ |
152 |
||||
| HMC994APM5ETR | 射频IC |
ADI/亚德诺 |
LFCSP-32 |
22+ |
200 |
|||
| PIC16F1704-I/SL | MICROCHIP/微芯 |
SOP14 |
22+ |
5000 |
||||
| XMC4500-F100K1024 AC | INFINEON/英飞凌 |
LQFP100 |
20+ |
980 |
||||
| M21024G-13 | MACOM |
BGA |
23+ |
500 |
||||
| SIA471DJ-T1-GE3 | VISHAY/威世 |
PAKSC-70 |
24+ |
600 |
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